Description
To solve some of the industry’s biggest challenges, it takes players both big and small. In this episode, our Julian Haslberger and special guest Jack Herring from Jiva Materials explain how they came together to address electronic waste with recyclable PCBs as part of Infineon’s Co-Innovation Program.
In this episode, we talk to Konrad Schraml and Caspar Leendertz again about their nomination for the Deutsche Zukunftspreis. Listen to learn about the technical challenges the team from Infineon and TU Chemnitz overcame to create the world's first 3.3 kV SiC MOSFET with a vertical channel and...
Published 11/18/24
We’ve been nominated for the prestigious Deutsche Zukunftspreis, the German Federal President‘s Award for Technology and Innovation! In this episode, we talk to Konrad Schraml and Caspar Leendertz about their submission: the world's first 3.3 kV SiC MOSFET with a vertical channel and innovative...
Published 11/05/24