Dan is joined by Jack Kang of SiFive. As a member of the founding team at SiFive, Jack oversees the Business Development, Customer Experience, and Corporate Marketing groups. He is responsible for strategic business initiatives and partnerships, technical pre-sales activities and post-sales support, and corporate messaging… Read More

Dan is joined by Jungwoo Joh, a Process Development Manager at Texas Instruments and Publicity Chair for IEDM 2023. He currently leads gallium nitride technology development for power applications, and has been working on reliability, device characterization & modeling, and process development for various GaN based … Read More

Dan is joined by Dave Fick, co-founder and CEO of Mythic. Dave leads Mythic to bring groundbreaking analog computing to the AI inference market. With a PhD in Computer Science & Eng from Michigan, he brings a wealth of knowledge and expertise to the industry. Dan explores Mythic’s unique analog computing capability … Read More

Dan is joined by Chris Morrison. Chris has 15 years’ experience of delivering innovative analog, digital, power management and audio solutions for international electronics. Currently he is the director of product marketing at Agile Analog, the analog IP innovators. Previously he has held engineering positions, including… Read More

Dan is joined by Frank Schirrmeister. Frank is vice president of solutions and business development at Arteris. He leads activities for industry verticals, including automotive and enterprise computing and technology horizontals like artificial intelligence, machine learning, and safety. For DAC 2024, Frank is the vice… Read More

Dan is joined by David French, CEO of SigmaSense. David is best known for his 20-year focus on digital signal processors at Texas Instruments, and Analog Devices. In addition, he spearheaded the transition of Cirrus Logic’s business as its CEO, from a supplier of logic chips into personal computers to become a profitable… Read More

Dan is joined by Matthew Burns, Matt develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. Matt and Dan discuss revelations from the recent… Read More

Dan is joined by Calista Redmond, CEO of RISC-V International. Prior to RISC-V International, Calista held a variety of roles at IBM, including vice president of IBM Z Ecosystem where she led strategic relationships across software vendors, system integrators, business partners, developer communities, and broader engagement… Read More

Dan is joined by Dr. Walden Rhines. Wally is a lot of things, CEO of Cornami, board member, advisor to many and friend to all. For this discussion he is the Executive Sponsor of the SEMI Electronic Design Market Data report. Dan explores the Q2 results summarized in the report with Wally. Overall growth was around 5%, a much lower number… Read More

Dan is joined by Anand Thiruvengadam, director of product and business management and head of the Solutions and Go-to-Market functions for the memory market segment at Synopsys. Anand discusses the substantial demands experienced by memory designers due to trends such as big data analytics. He describes how these demands impact… Read More

Dan is joined by Richard Barnett, chief marketing officer and SaaS sales leader at Supplyframe. With more than 25 years of leadership experience in strategic marketing, sales and product management, Richard is recognized as a thought leader on supply chain and strategic sourcing transformation as well as digital marketing … Read More

Dan is joined by Dr. Rahul Manepalli. Rahul is an Intel Fellow and Sr. Director of Module Engineering in the Substrate Package Technology Development Organization. Rahul and his team are responsible for developing the next generation of materials, processes and equipment for Intel’s package substrate pathfinding and development… Read More

Dan is joined by Dr. Victor Moroz, a Synopsys Fellow engaged in a variety of projects on leading edge modeling Design-Technology Co-Optimization. He has published more than 100 technical papers and over 300 US and international patents. Victor has been involved in many technical committees and is currently serving as an Editor… Read More

Dan is joined by Dan Kochpatcharin, Dan joined TSMC in 2007. Prior to his current role heading up the Design Infrastructure Management Division, Dan led the Japan customer strategy team, the technical marketing and support team for the EMEA region in Amsterdam and was a part of the team leading the formation of the TSMC Open Innovation… Read More

Dan is joined by Milind Weling, the Head of Device and Lab to Fab Realization and co-founder of the neuro-inspired Computing Incubator of EMD Electronics. Previously he was senior vice president for Intermolecular. He led customer programs and operations where he drove the discovery and optimization of new materials, integrated… Read More

Dan is joined by Mike Ingster from Quantum Leap Solutions (QLS) and Ken Potts from Alphacore. Mike and Ken explain how QLS and Alphacore collaborate to provide industry-leading IP and system solutions to their mutual customers. The markets served by both QLS and Alphacore are discussed and the synergies are explained in this informative… Read More

Dan is joined by Carl Moore, a semiconductor and yield management expert with a career spanning 40 years. Carl’s held technical management positions across product and test engineering, assembly, manufacturing, and design at established semiconductor companies. Carl is passionate about data analytics and has a reputation… Read More

Dan is joined by Sean Redmond, managing partner for Silicon Catalyst. Sean has nearly 40 years of experience in the semiconductor and software industries including stints at VLSI technology, Verisity Design, Cadence, ARC, and others. Sean has recently worked closely with the UK government on industrial digital strategy, co-chairing… Read More

Dan is joined by a panel of experts to discuss chiplets and 2.5/3D design. The panelists are: Saif Alam – Vice President of Engineering at Movellus Inc., Tony Mastroianni Siemens EDA- Advanced Packaging Solutions Director and Craig Bishop – CTO Deca Technologies. In this spirited and informative discussion the … Read More

Dan is joined by William Ruby, director of product management for Synopsys Power Analysis products. He has extensive experience in the area of low-power IC design and design methodology, and has held senior engineering and product marketing positions with Cadence, ANSYS, Intel, and Siemens. He also has a patent in high-speed… Read More

Dan is joined by Stephen Fairbanks, CEO of Certus Semiconductor. Stephen is an ESD pioneer with over 30 years of experience starting with his time at Intel, SRF Technologies, and now Certus Semiconductor. Stephen describes the varied challenges of ESD andI/O library design presented by today’s technologies and design… Read More

Dan is joined by Tareq Bustami, senior vice president of marketing & sales, Axiado. Tareq has more than 20 years of experience in the semiconductor and networking industries. Before joining Axiado, he led NXP’s embedded processors for the wired and wireless markets, and was in charge of growing multi-core processor solutions… Read More

Dan is joined by Chris Shrope. Chris leads high tech product marketing at Model N, a compliance leader for high-tech manufacturers. Chris has deep experience defining product market fit and related new product development activities. He received his MBA and holds certifications in Economics, Law, Product Management and Marketing.… Read More

Dan is joined by Dr. Adam Carter, CEO of OpenLight. Adam has over 25 years of experience in the semiconductor industry, including a variety of roles in Networking, Optical Communication Systems, Optical Components and Modules markets. Adam describes OpenLight’s unique silicon photonics platform – what makes … Read More

Dan is joined by Dave Lazovsky, CEO of Celestial AI. Dave has an in-depth knowledge of semiconductor, data/telecommunications, photonics and clean energy industries, as well as extensive international business experience. He currently has over 50 issued and 5 pending U.S. patents. In this broad and forward-looking discussion,… Read More