In this special episode of the 3D InCites Podcast, in partnership with the International Microelectronics and Packaging Society (IMAPS), we talk to Steve Kummerl,TI; and Mark Gerber, ASE, about the upcoming CHIPcon event which takes place July 24-27 in San Jose CA. This conference is a rebrand and restructuring of what was formerly the Advanced System in Packaging Symposium. Kummerl is the General Chair for the event, and Gerber is on the IMAPS Academic Committee. They are part of the team that put together a very robust agenda, with expert speakers from across the chiplet ecosystem.   CHIPCon stands for Chiplet Heterogeneous Integration and Packaging Conference. Kummerl and Gerber talk about the motivation for repositioning the conference, and how the speakers were selected to represent the end-to-end chiplet ecosystem. They also explain how CHIPCon is differentiated from the annual IMAPS International Device Packaging Conference. They provide some details of what attendees can expect to learn by attending this event.  Note that Early Bird Registration AND the hotel block ends today, June 30, 2023. Registration for both is found at www.chipcon.org.  IMAPS International IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and Twitter Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.