Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization.  The specific technology focus is on plasma dicing, its uses, particularly in die-to-wafer hybrid bonding, and the path to adoption. Thomas addresses in detail some of the process challenges and how SPTS has addressed them. He also talks about the fast-moving technical requirements that make the processes for packaging applications highly competitive.  To learn more about plasma dicing, read this article published by KLA on 3D InCites.    KLA, SPTS Division KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more. Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.Support the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and Twitter Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.