This episode was recorded live at IMAPS CHIPCon, where experts in heterogeneous integration and chiplet-enabled advanced packaging schemes gathered to address some of the semiconductor manufacturing industries most pressing technical and industry-related challenges.  Françoise von Trapp speaks with Scott Sikorski, of IBM who demystifies the complexities of the CHIPS Act, and the opportunities available for companies hoping to participate in R&D for advanced packaging. He also discusses the challenges of onshoring commercial advanced packaging.   She also interviews Amkor’s Mike Kelly and ASE Group’s Ou Li, two of the panelists who participated in the panel discussion moderated by Jan Vardaman. The panel addressed the question, Are Chiplets the Answer for AI, ML, and Photonic/co-packaged optics? Kelly and Li share some of the key takeaways from the panel discussion, such as the challenges chiplet architectures address for AI, ML, and photonics/co-packaged optics, as well as outsourced semiconductor assembly and test service providers (OSATS) readiness for chiplet integration. They also talk about the availability of 3rd party chiplets, and help unravel the mysteries of the available chiplet interfaces, like the Universal Chiplet Interconnect Express (UCIe), To learn more about takeaways from CHIPCon, you can read Françoise’s blog post here.   Contact Our Guests on LinkedIn Scott Sikorski, IBMMike Kelly, Amkor Technology Ou Li, ASE GroupSupport the showBecome a sustaining member! Like what you hear? Follow us on LinkedIn and Twitter Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more. Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.